Hybrid technology

Hybrid Integrated circuited are fabricated by using different types of Individual Chips.
Mixed Technology can be bought together in this technology. Hybrid technology provides more flexibility in the System level Design

IPDThick FilmThin FilmLTCCPCB

Integrated Passive Devices​

Passive components forms the vital parts of any System In Package solutions. It provides various functions such as decoupling, biasing, resonating, filtering, matching, transforming, etc.

With the tremendous growth of electronics Industry in many years, the increased integration of a small lightweight, small form factor and excellent electrical performance increases the need for Integrated passive circuit.
With the integration and fabrication of passive devices on the silicon wafer, we can produce significantly smaller, thinner and better performance IPDs than the discrete passive devices that are available today.

Thick Film ​

Thick film technology generally used to built the surface mount devices.

Thick-film processing is a sequence of print, dry, and fire operations, multiple power, ground, and signal layers can be deposited by alternating conductor and insulator layers.

Thick-film technology is important in the production of a broad spectrum of hybrid integrated circuits, networks, and discrete passive components.

Thin Film​

Thin film deposition is a process in which the physical characteristics of a surface are improved by applying a very thin coating, often just a few millionths of a millimetre thick.

Thin films are generally used to improve the surface properties of solids.

Transmission, reflection, absorption, hardness, abrasion resistance, corrosion, permeation and electrical behaviour are  some of the properties of a bulk material surface that can be improved by using a thin film. Nanotechnology also is based on thin film technology.

Why RFIC Solutions for LTCC?​

RFIC Solutions  offers

  • Low permittivity tolerance
  • Good thermal conductivity
  • Low TCE (adapted to silicon and GaAs)
  • Excellently suited for multilayer modules
  • Integration of cavities and passives such as R, L, and C components
  • Very robust against mechanical and thermal stress (hermetically sealed)

Low Temperature Co-fired Ceramic Technology(LTCC) Fundamentals​

The quality of wide tunable range thermal expansion coefficient make LTCC more attractive in various Microwave integrated Packaging . LTCC also provide low conductor loss,low substrate Loss,and has upto 50 Laminated layer. The challenging issue in LTCC module designs is the integrated passives, the emphasis of the examples will be placed on the embedded passives and system integration.


  • High density Embedded RF Passive function
  • High dimensional Accuracy
  • Enhanced mechanical Strength
  • Design Support
  • Short Prototype turn around time

Why RFIC Solutions for PCB?​

RFIC Solutions design team in India  are expertise in designing Multilayer PCB’s (24 layers).RFIC Solutions has designed complex Rigid, Rigid-flex, Metal core boards of frequency range > 70 GHz with the maximum board size of 9X11 inch.RFIC Solutions team has hands on experience in PCB design tools, like Concept HDL-XL, Allegro PCB XL, Spectra Router XL, OrCAD-CIS, OrCAD PCB Designer.RFIC Solutions can provide complete solutions from starting to the development of multilayer PCB design.

RFIC Solutions Expertise in PCB  :

PCB Layout, Component on top/bottom sides.  PCB Board Revision Engineering (impedance controlled, high speed PCBs).  Software CAD-OrCAD PCB Designer, Cadence, Allegro, Protel CAM-UCAM CAMs/w, GC-Prevue    Plus, Valor Trilogy 5000. Component Technologies SMT, DIP, combination. Board Technologies-Digital, Analog and Mixed Signal. PCB design upto 24 layers and more. PCB fabrication materials FR4, FR406, Isola 370HR, Black FR4 are used. Customer’s   preferred material are also considered.