Passive components forms the vital parts of any System In Package solutions. It provides various functions such as decoupling, biasing, resonating, filtering, matching, transforming, etc.
With the tremendous growth of electronics Industry in many years, the increased integration of a small lightweight, small form factor and excellent electrical performance increases the need for Integrated passive circuit.
With the integration and fabrication of passive devices on the silicon wafer, we can produce significantly smaller, thinner and better performance IPDs than the discrete passive devices that are available today.