Why RFIC Solutions for LTCC?
RFIC Solutions offers
- low permittivity tolerance
- good thermal conductivity
- low TCE (adapted to silicon and GaAs)
- excellently suited for multilayer modules
- integration of cavities and and passives such as R, L, and C components
- very robust against mechanical and thermal stress (hermetically sealed)
Low Temperature Co-fired Ceramic Technology(LTCC) Fundamentals
The quality of wide tunable range thermal expansion coefficient make LTCC more attractive in
various Microwave integrated Packaging .
LTCC also provide low conductor loss,low substrate Loss,and has upto 50 Laminated layer.
The challenging issue in LTCC module designs is the integrated passives, the emphasis of
the examples will be placed on the embedded passives and system integration.
Features
- High density Embedded RF Passive function
- High dimensional Accuracy
- Enhanced mechanical Strength
- Design Support
- Short Prototype turn around time
